Geekbench Lists Global Model of Honor Magic V3 Featuring Snapdragon 8 Gen 3 Chipset

The Honor Magic V3, released in China in July as the company’s latest foldable phone, may soon debut in global markets. A new version of the device has appeared on a popular performance benchmarking site, giving insight into what to expect if it launches elsewhere. The manufacturer is expected to outfit the Magic V3 foldable phone with similar specs to the Chinese model.

A device with the model number “FCP-N49” was identified on Geekbench, with an octa-core processor scoring 1,914 points in the single-core test and 5,354 points in the multi-core test. The primary core of the chipset reaches 3.30GHz, according to the listing.

The phone will feature an Adreno 750 GPU, suggesting it will run on a Snapdragon 8 Gen 3 chipset, Qualcomm’s flagship processor launched in 2023. It is expected to come with 12GB of RAM.

Although the Geekbench listing does not directly name the handset with the model number FCP-N49, it matches a listing on a Telecommunications And Digital Government Regulatory Authority (TDRA) database for the Honor Magic V3. The Chinese version of the Magic V3 is identified as FCP-AN10.

Specifications for the Honor Magic V3 include a 7.92-inch primary LTPO OLED display and a 6.43-inch LTPO OLED cover display, both with stylus support. It runs on a Snapdragon 8 Gen 3 chipset, with up to 16GB of RAM and 512GB of storage.

The phone operates on MagicOS 8.0.1, based on Android 14, and boasts a triple rear camera setup – a 50-megapixel primary camera, a 50-megapixel telephoto camera, and a 40-megapixel ultra-wide angle camera. For selfies, there is a 40-megapixel wide-angle inner camera. The device is powered by a 5,150mAh silicon carbon battery with 66W wired charging support and has an IPX8 rating for dust and splash resistance.